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These components generate significant amounts of heat, necessitating advanced cooling systems to prevent overheating and ensure consistent performance.
However, as server densities increase, these air-based systems have become insufficient.
To address these limitations, more efficient cooling methods have emerged, including immersion cooling and direct-to-chip cooling.
The metal foams are available in various compositions including copper, nickel, iron, and stainless steel.
The foams have densities ranging from 0.9 to 2.2 g/cm3.
There is also potential for two-phase direct-to-chip cooling.
Furthermore, the large surface area makes the foams suitable for use as electrodes and catalysts.
This also occurs in immersion cooling.
