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As AI workloads grow more complex and data-heavy, the need for energy-efficient memory solutions becomes paramount.
This makes it a crucial component for AI accelerators and data centers managing large workloads.
These two rivals are aggressively pursuing the next big thing in high-bandwidth memoryHBM4.
Despite the pressure from its competitors, Microns HBM3E 12-high memory remains a critical player in the AI ecosystem.
A notable collaboration is Microns partnership with TSMCs 3DFabric Alliance, which helps optimize AI system manufacturing.
